Cooling Solutions
All listed cooling solutions are available for each congatec Embedded Computer Module.
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Thermal StacksThe thermal stacks can be used to connect heat generating devices such as CPU and chipset to the system's metal housing. |
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HeatspreaderThe heatspreader is a clearly defined thermal interface between the COM and the cooling solution. |
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Active Cooling SolutionThe active cooling solution is equipped with an integrated low-noise powerful fan. |
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Passive Cooling SolutionDepending on the processor performance, additional air flow may be required within the system. |








