congatec, Inc (USA)

congatec AG
Auwiesenstrasse 5
94469 Deggendorf, Germany
Tel +49 (991) 2700-0
info(at)congatec.com

   
 
 

Cooling Solutions

All listed cooling solutions are available for each congatec Embedded Computer Module.



Thermal Stacks


The thermal stacks can be used to connect heat generating devices such as CPU and chipset to the system's metal housing.



Heatspreader


The heatspreader is a clearly defined thermal interface between the COM and the cooling solution.



Active Cooling Solution


The active cooling solution is equipped with an integrated low-noise powerful fan.



Passive Cooling Solution


Depending on the processor performance, additional air flow may be required within the system.