All types of cooling solutions are available for every congatec Embedded Computer Module.
Supported Standards:
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The thermal stacks can be used to connect heat generating devices such as CPU and chipset to the system’s metal housing.
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The heatspreader is a clearly defined thermal interface between the COM and the system cooling solution. |
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congatec passive cooling solutions replace the heatspreader with a dedicated passive cooler. Depending on the CPU of the selected module, additional airflow within the system may be required. |
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congatec active cooling solutions replace the heatspreader with a dedicated cooler including a silent and powerful fan.
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