Qseven 2.0 module based on AMD Embedded GX-210HA SOC with AMD Radeon™ HD 8210E Graphics (TDP 9W) with on-board memory 2GB ECC DDR3L-1333
conga-QG
基于高性能,低功耗AMD嵌入式G系列SoC單芯片的Qseven模块
- 基于高性能,低功耗AMD嵌入式G系列SoC單芯片的Qseven模块
- 提供表贴ECC寄存式内存和扩温选項
Specification
Documents
Manual
Data Sheet
Software
Use for BIOS update or customization and panel configuration.Linux source version.
Use for BIOS update or customization and panel configuration.Linux source version.
Use for BIOS update or customization and panel configuration.
Use for BIOS update or customization and panel configuration.
Use for BIOS update or customization and panel configuration.
Use for BIOS update or customization and panel configuration.
Use for BIOS update or customization and panel configuration.
Product Variants
Qseven 2.0 module based on AMD Embedded GX-210HA SOC with AMD Radeon™ HD 8210E Graphics (TDP 9W) with on-board memory 2GB ECC DDR3L-1333 and 4GB MLC SATA Solid State Disk.
Qseven 2.0 module based on AMD Embedded GX-210JA SOC with AMD Radeon™ HD 8180E Graphics (TDP 6W) with on-board memory 2GB ECC DDR3L-1066
Qseven 2.0 module based on AMD Embedded GX-212JC SOC with AMD Radeon™ Graphics (Dual-core, 6W TDP, CPU freq. 1.2/1.4GHz, GPU freq. 351MHz) with on-board memory 2GB ECC DDR3L-1333
Qseven 2.0 module based on AMD Embedded GX-412HC SOC with AMD Radeon™ Graphics (Quad-core, 7W TDP, CPU freq. 1.2/1.6GHz, GPU freq. 400MHz) with on-board memory 4GB ECC DDR3L-1333
Ecosystem Details
Cooling solutions
Standard heatspreader for Qseven module conga-QG
Standard heatspreader for Qseven module conga-QG. All standoffs are with 2.7mm bore hole.
Passive cooling solution for Qseven module conga-QG. All standoffs are M2.5mm thread.
Passive cooling solution for Qseven module conga-QG. All standoffs are with 2.7mm bore hole.
Accessories
conga-QEVAL/Qseven 2.0
康佳特提供此评估载板以快速启动Qseven ™模块,该载板将所有Qseven ™模块的信号发送至标准接口连接器。
conga-LDVI
适用于LVDS的DVI转换模块