Congatec AG
We simplify the use of embedded technology

Press Releases

24. November 2009

congatec Presents Compact COM Express Module conga-CS45 with Superior Graphics Performance

Uses the latest generation of Intel® processors

Nuremberg, Germany, SPS/IPC/Drives,  24 November 2009   * * *    congatec AG is launching the conga-CS45, a new high-performance COM Express compact module, at this year’s SPS/IPC/Drives show. The module features the  Intel® GS45 small form factor (SFF) chipset, which enables significant performance increases despite a smaller footprint and lower power consumption. The module is particularly suitable for mobile applications which require high graphics performance such as portable ultrasound devices. The module offers true high-end graphics performance which was hitherto unprecedented at such small dimensions. Even hardware implemented decompression for HDTV videos is already integrated in the chipset. In addition, the module offers a large choice of graphics interfaces ranging from SDVO, DVI and HDMI to DisplayPort.

The conga-CS45 is equipped with the latest generation of 45nm Intel processors including  the Intel® Celeron ULV722 with a mere 5.5 Watt TDP (Thermal Dissipation Power) or the Intel Core 2 Duo SP9300 with 25 Watt TDP as well as 6 MB storage capacity and clock speed of  2.3 GHz.

The conga-CS45 can be upgraded to 4 GB of DDR3 memory with 1067 MHz. Compared to DDR2 memory, DDR3 technology requires approximately 20% less power. The module has three serial ATA connectors with RAID support which further improve the performance and data security of mass storage. It also offers optional support of Intel Active Management Technology (AMT 4.0) which enables remote control via Ethernet or Internet even before starting the operating system.

To meet the special needs of mobile applications the conga-CS45 permits Core Sleep States C0 to C6 which makes it easy to optimize the power requirements for each scenario.


Price and availability

The conga-CS45 is available for mass production as of January 2010. Engineering samples are available now.