From May 10th to 12th, congatec will be exhibiting at the ESEC show in Tokyo, Japan. It attracts thousands of visitors and hundreds of exhibitors are showcasing the latest embedded technology.
congatec will be showing a complete line of embedded computer modules, single board computers (SBCs) and embedded design and manufacturing services.
- Boards and modules based on the latest Intel processor (Kaby lake)
- Industrial Ready-To-Use platform
- Power saving embedded modules
- Fast, energy efficient and high performance modules
- Brand new SMARC 2.0 platform with USB Type-C
- COM Express 3.0 Type 7 –Real Time Hypervisor
Highest Performance Thin-Mini-ITX board based on 7th Generation Intel® Core™ Mobile SOC U-Processors
COM Express Type 7 Basic module based on the latest Intel® Xeon™ and Intel® Pentium™ processor family